Heating apparatus, heat treatment apparatus, computer program and storage medium
US8041197B2 · kind B2 · utility
534Cited by
17References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2008 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | May 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heating apparatus for heating a target object W is provided with a plurality of heating light sources, including LED elements for applying heating light having a wavelength within a range from 360 to 520 nm to the object. Thus, a temperature of only the shallow surface of the object, such as a semiconductor wafer, is increased/reduced at a high speed in uniform temperature distribution, irrespective of the film type.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.