Method for manufacturing multilayer flexible printed circuit board
US8042265B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 14, 2007 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Jul 6, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a multilayer FPCB includes the steps of: providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit is configured to be aligned with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.