Apparatus for and method of processing substrate
US8043468B2 · kind B2 · utility
4Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2008 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Oct 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67086
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus discharges a hydrofluoric acid solution from discharge nozzles toward grooves formed in side walls of an inner bath. The hydrofluoric acid solution discharged from the discharge nozzles impinges upon the grooves to diffuse, thereby moving toward a top portion of the inner bath in the form of low-speed uniform liquid flows. Thus, a metal component and foreign substances generated in the inner bath float up toward the top portion of the inner bath without being agitated within the inner bath, and are rapidly drained to an outer bath together with the hydrofluoric acid solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.