Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
US8043709B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2004 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Nov 11, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2991
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.