Low density drain HEMTs
US8044432B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2006 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Nov 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8503
Abstract
Methods and devices for fabricating AlGaN/GaN normally-off high electron mobility transistors (HEMTs). A fluorine-based (electronegative ions-based) plasma treatment or low-energy ion implantation is used to modify the drain-side surface field distribution without the use of a field plate electrode. The off-state breakdown voltage can be improved and current collapse can be completely suppressed in LDD-HEMTs with no significant degradation in gains and cutoff frequencies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.