Photosensitive integrated circuit equipped with a reflective layer and corresponding method of production
US8044443B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2006 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Apr 8, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/805
Abstract
A method for producing a photosensitive integrated circuit including producing circuit control transistors, producing, above the control transistors, and between at least one upper electrode and at least one lower electrode, at least one photodiode, by amorphous silicon layers into which photons from incident electromagnetic radiation are absorbed, producing at least one passivation layer, between the lower electrode and the control transistors, and producing, between the control transistors and the external surface of the integrated circuit, a reflective layer capable of reflecting photons not absorbed by the amorphous silicon layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.