Patent · US Active

QFN semiconductor package

US8044496B2 · kind B2 · utility

6Cited by

17References

12Claims

0Family size

Assignee

MEDIATEK INC. · TW

Inventors

Tung-Hsien Hsieh · 埔鹽鄉, TW
Nan-Cheng Chen · Baoshan, TW

Key dates

Filing date	Jul 21, 2010
Grant date	Oct 25, 2011
Priority date	—
Expiry date	Jul 21, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A QFN semiconductor package includes a die attach pad; a semiconductor die mounted on the die attach pad; an inner terminal lead disposed adjacent to the die attach pad; a first wire bonding the inner terminal lead to the semiconductor die; an extended, outer terminal lead disposed along periphery of the QFN semiconductor package, wherein the extended, outer terminal lead is disposed beyond a maximum wire length which is provided for a specific minimum pad opening size on the semiconductor die; an intermediary terminal disposed between the inner terminal lead and the extended, outer terminal lead; a second wire bonding the intermediary terminal to the semiconductor die; and a trace interconnecting the intermediary terminal to the extended, outer terminal lead.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.