Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factor
US8044553B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2010 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | May 14, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A SAW device having metal electrodes on a surface of the piezoelectric substrate includes a dielectric layer deposited on the surface. Depositing the layer results in seams extending upward from the electrodes extending above the surface of the substrate. An additional seam results from one seam extending from one electrode joining a second seam extending from an adjacent electrode within the dielectric layer and is generally formed above the height of the electrodes. The additional seam is removed through planarization or the like. The dielectric layer may be further planarized for providing a thickness of the dielectric layer above the electrodes as desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.