Semiconductor device with thermal fault detection
US8044674B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2009 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | May 19, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor device with a thermal fault detection is disclosed. According to one example of the invention such a semiconductor device includes a semiconductor chip including an active area. It further includes a temperature sensor arrangement that provides a measurement signal dependent on the temperature in or close to the active area, the measurement signal having a slope of a time-dependent steepness, and an evaluation circuit that is configured to provide an output signal that is representative of the steepness of the slope of the measurement signal and further configured to signal a steepness higher than a predefined threshold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.