Method and apparatus providing an imager module with a permanent carrier
US8048708B2 · kind B2 · utility
2Cited by
3References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2008 |
| Grant date | Nov 1, 2011 |
| Priority date | — |
| Expiry date | Jun 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method and apparatus providing a wafer level fabrication of imager modules in which a permanent carrier protects imager devices on an imager wafer and is used to support a lens wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.