Methods and systems for laser machining a substrate
US8048774B2 · kind B2 · utility
0Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2002 |
| Grant date | Nov 1, 2011 |
| Priority date | — |
| Expiry date | Aug 25, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A formation in a first surface of a substrate is machined by an ultraviolet or visible radiation laser, to a predetermined depth that is less than a full depth of the substrate; and material is removed from a second surface of the substrate opposed to the first surface to the predetermined depth from the first surface to communicate with the formation. Material may be removed by, for example, lapping and polishing, chemical etching, plasma etching or laser ablation. The invention has application in, for example, dicing semiconductor wafers to forming metallised vias in wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.