Semiconductor device
US8050049B2 · kind B2 · utility
0Cited by
0References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2009 |
| Grant date | Nov 1, 2011 |
| Priority date | — |
| Expiry date | Dec 31, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a semiconductor device of a double-side mounting structure including a circuit board and a plurality of semiconductor chips arranged and joined together on the opposite surfaces of the circuit board, wherein in an area in which the semiconductor chip 31 mounted on the top surface of the circuit board 2 overlaps with the semiconductor chip 32 mounted on the bottom surface of the circuit board 2, a recess portion 21 (or a protruding portion 22) is formed in the surfaces of the circuit board 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.