CMOS SiGe channel pFET and Si channel nFET devices with minimal STI recess
US8053301B2 · kind B2 · utility
24Cited by
2References
14Claims
0Family size
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Key dates
| Filing date | Mar 30, 2009 |
| Grant date | Nov 8, 2011 |
| Priority date | — |
| Expiry date | Sep 19, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0188
Abstract
Silicon germanium (SiGe) is epitaxially grown on a silicon channel above nFET and pFET regions of a substrate. SiGe is removed above the nFET regions. A device includes a silicon channel above the nFET regions and a SiGe channel above the pFET regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.