Daniel Jaeger
35Patents
6h-index
72Co-inventors
68Inventor score
Filing activity: Mar 30, 2009 → Nov 8, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8053301B2 | CMOS SiGe channel pFET and Si channel nFET devices with minimal STI recess | Electricity | 24 | Active |
| US10269654B1 | Methods, apparatus and system for replacement contact for a finFET device | Electricity | 9 | Active |
| US10325819B1 | Methods, apparatus and system for providing a pre-RMG replacement metal contact for a finFET device | Electricity | 9 | Active |
| US8129234B2 | Method of forming bipolar transistor integrated with metal gate CMOS devices | Electricity | 9 | Active |
| US9035430B2 | Semiconductor fin on local oxide | Electricity | 6 | Active |
| US9761452B1 | Devices and methods of forming SADP on SRAM and SAQP on logic | Electricity | 6 | Active |
| US9041076B2 | Partial sacrificial dummy gate with CMOS device with high-k metal gate | Electricity | 3 | Active |
| US10644156B2 | Methods, apparatus, and system for reducing gate cut gouging and/or gate height loss in semiconductor devices | Electricity | 3 | Active |
| US9299795B2 | Partial sacrificial dummy gate with CMOS device with high-k metal gate | Electricity | 3 | Active |
| US10204797B1 | Methods, apparatus, and system for reducing step height difference in semiconductor devices | Electricity | 2 | Active |
| US10340142B1 | Methods, apparatus and system for self-aligned metal hard masks | Electricity | 2 | Active |
| US10373875B1 | Contacts formed with self-aligned cuts | Electricity | 2 | Active |
| US9589829B1 | FinFET device including silicon oxycarbon isolation structure | Electricity | 2 | Active |
| US10833160B1 | Field-effect transistors with self-aligned and non-self-aligned contact openings | Electricity | 2 | Active |
| US10418455B2 | Methods, apparatus and system for stringer defect reduction in a trench cut region of a finFET device | Electricity | 1 | Active |
| US8629028B2 | Metal oxide semiconductor field effect transistor (MOSFET) gate termination | Electricity | 1 | Active |
| US10991796B2 | Source/drain contact depth control | Electricity | 1 | Active |
| US8415212B2 | Method of enhancing photoresist adhesion to rare earth oxides | Electricity | 1 | Active |
| US9780002B1 | Threshold voltage and well implantation method for semiconductor devices | Electricity | 1 | Active |
| US10971625B2 | Epitaxial structures of a semiconductor device having a wide gate pitch | Electricity | 0 | Active |
| US10522639B2 | Methods, apparatus and system for stringer defect reduction in a trench cut region of a finFET device | Electricity | 0 | Active |
| US10460986B2 | Cap structure | Electricity | 0 | Active |
| US10930549B2 | Cap structure | Electricity | 0 | Active |
| US10714376B2 | Method of forming semiconductor material in trenches having different widths, and related structures | Electricity | 0 | Active |
| US10062612B2 | Method and system for constructing FINFET devices having a super steep retrograde well | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.