Image-sensing module for reducing overall thickness thereof and preventing EMI
US8054639B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 1, 2008 |
| Grant date | Nov 8, 2011 |
| Priority date | — |
| Expiry date | Apr 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/042
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image-sensing module for reducing its overall thickness and preventing electromagnetic interference (EMI) includes a flexible substrate, an image sensor, and a plurality of electronic elements. The flexible substrate has a first PCB (Printed Circuit Board), a flexible bending board bent upwards from one side of the first PCB, and a second PCB extending forwards from the flexible bending board and disposed above the first PCB. The second PCB has at least one first opening. The image sensor is electrically disposed on the first PCB, and the image sensor is exposed by the first opening of the second PCB. The electronic elements are selectively electrically disposed on the first PCB and/or on the second PCB so that the electronic elements are disposed between the first PCB and the second PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.