Laminated body of semiconductor chips including pads mutually connected to conductive member
US8058717B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 28, 2010 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Apr 28, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip laminated body includes a wiring board having a connecting terminal; a plurality of semiconductor chips laminated on the wiring board, each of the semiconductor chips having a pad; conductive connecting members having first end parts connected to the pads of the corresponding semiconductor chips and second end parts projecting from side surfaces of the corresponding semiconductor chips; and a conductive member configured to connect the connecting terminal of the wiring board and the second end parts of the conductive connecting members; wherein conductive materials are exposed at the side surfaces of the semiconductor chips; and a gap is provided between the side surfaces of the semiconductor chips and the conductive member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.