Substrates with slotted metals and related methods
US8059385B2 · kind B2 · utility
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8References
24Claims
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Key dates
| Filing date | Dec 5, 2007 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Feb 4, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Substrates with slotted metals and related methods are provided. According to one aspect, a slotted metal attached to a substrate can include a metal patterned with slots less than or about equal to 2 microns. The slots can result in line widths that are approximately the size of a single metallurgical grain in an unpatterned layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.