High throughput method of in transit wafer position correction in system using multiple robots
US8060252B2 · kind B2 · utility
532Cited by
19References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2007 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Jul 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods correcting wafer position error are provided. The methods involve measuring wafer position error on a robot, e.g. a dual side-by-side end effector robot, during transfer to an intermediate station. This measurement data is then used by a second robot to perform wafer pick moves from the intermediate station with corrections to center the wafer. Wafer position correction may be performed at only one location during the transfer process. Also provided are systems and apparatuses for transferring wafers using an intermediate station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.