Use of CMP for aluminum mirror and solar cell fabrication
US8062096B2 · kind B2 · utility
10Cited by
35References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2005 |
| Grant date | Nov 22, 2011 |
| Priority date | — |
| Expiry date | Nov 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is directed to a method of polishing a surface of a substrate comprising aluminum, comprising contacting a surface of the substrate with a polishing pad and a polishing composition comprising an abrasive, an agent that oxidizes aluminum, and a liquid carrier, and abrading at least a portion of the surface to remove at least some aluminum from the substrate and to polish the surface of the substrate, wherein the abrasive is in particulate form and is suspended in the liquid carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.