Method and apparatus for control of layer thicknesses
US8062705B2 · kind B2 · utility
4Cited by
7References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 2, 2003 |
| Grant date | Nov 22, 2011 |
| Priority date | — |
| Expiry date | Mar 9, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
It is shown a method and apparatus for distributing a viscous liquid over a surface of a substrate, e.g. a semiconductor wafer or a datastorage media, by conditioning the substrate thermally, locally specific before or during the spin coating process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.