Sub-module conformal electromagnetic interference shield
US8062930B1 · kind B1 · utility
25Cited by
61References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2006 |
| Grant date | Nov 22, 2011 |
| Priority date | — |
| Expiry date | May 17, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a manufacturing process of a sub-module having an electromagnetic shield. Initially, a meta-module having circuitry for two or more sub-modules is formed. An overmold body is placed over the circuitry for all of the sub-modules. The overmold body of the meta-module is sub-diced to expose a metallic layer grid around each of the sub-modules. Next, an electromagnetic shield is applied to the exterior surface of the overmold body of each of the sub-modules and in contact with the metallic layer grid. The meta-module is then singulated to form modules having two or more sub-modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.