Patent · US Active

Method of encapsulating an electronic component

US8065793B2 · kind B2 · utility

0Cited by

7References

6Claims

0Family size

Assignee

FUJITSU LIMITED · JP

Inventors

Kazuyuki Ikura · Kawasaki, JP
Junzou Une · Kawasaki, JP
Jun Matsueda · Kawasaki, JP

Key dates

Filing date	Nov 12, 2009
Grant date	Nov 29, 2011
Priority date	—
Expiry date	Nov 12, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/53178
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An application method for resin includes applying resin to a first electronic component in an application chamber under a first internal pressure, moving a second electronic component into an internal pressure adjustment chamber under a second internal pressure which is higher than the first internal pressure and adjusting an internal pressure of the internal pressure adjustment chamber from the second internal pressure to the first internal pressure, and moving the second electronic component into the application chamber while moving the first electronic component into the internal pressure adjustment chamber after the step of application of the resin has been completed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.