Polishing pad
US8066555B2 · kind B2 · utility
39Cited by
4References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 28, 2008 |
| Grant date | Nov 29, 2011 |
| Priority date | — |
| Expiry date | Nov 22, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad includes polishing elements interdigitated with one another over a surface of the polishing pad. Each of the polishing elements is secured so as to restrict lateral movement thereof with respect to others of the polishing elements, but remains moveable in an axis normal to a polishing surface of the polishing elements. Different densities of the polishing elements may be positioned within different areas of the surface of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.