Forming a layer on a substrate
US8066930B2 · kind B2 · utility
55Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2010 |
| Grant date | Nov 29, 2011 |
| Priority date | — |
| Expiry date | Mar 30, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention is directed to a method of forming an imprinting layer on a substrate including high resolution features, and transferring the features into a solidified region of the substrate. Desired thickness of the residual layer may be minimized in addition to visco-elastic behavior of the material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.