Electrically conductive structure on a semiconductor substrate formed from printing
US8067305B2 · kind B2 · utility
32Cited by
7References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2008 |
| Grant date | Nov 29, 2011 |
| Priority date | — |
| Expiry date | May 16, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided are methods for forming an electrically conductive structure of a desired three-dimensional shape on a substantially planar surface of a substrate, e.g., a semiconductor wafer. Typically, the particulate matter is deposited in a layer-by-layer manner and adhered to selected regions on the substrate surface. The particulate matter may be deposited to produce a mold for forming the structure and/or to produce the structure itself. A three-dimensional printer with associated electronic data may be used without the need of a lithographic mask or reticle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.