Digital camera module using stacked chip package
US8072489B2 · kind B2 · utility
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0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2006 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Oct 6, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chip package (101) and a lens module (103) mounted on the chip package are provided. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.