Optical inspection system and method

US8072591B2 · kind B2 · utility

Assignee

• Nanda Technologies GmbH · DE

Inventors

• Lars Markwort · Haimhausen, DE
• Rajeshwar Chhibber · San Jose, US
• Klaus Eckerl · Hutthurm, DE
• Norbert Harendt · Hutthurm, DE

Key dates

• Filing date: Mar 1, 2010
• Grant date: Dec 6, 2011
• Expiry date: Mar 1, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L22/12
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A wafer inspection system has a bright field imaging beam path and a dark field imaging beam path to obtain bright field images and dark field images of a full 300 mm wafer. The optical system provides for telecentric imaging and has low optical aberrations. The bright field and dark field beam paths are folded such that the system can be integrated to occupy a low volume with a small foot print.