Patent · US Active

Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame

US8072770B2 · kind B2 · utility

2Cited by

6References

19Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Steven Kummerl · Carrollton, US
Sreenivasan K. Koduri · Allen, US

Key dates

Filing date	Mar 26, 2009
Grant date	Dec 6, 2011
Priority date	—
Expiry date	Apr 29, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19041
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material disposed around a lead frame and at least an integrated circuit (IC), wherein the IC is electrically connected with one side of the lead frame. The opposite side of the lead frame including, for example, lead segments, can be exposed from the mold material. A variety of other components, devices, and packages can then be assembled, e.g., over the disclosed packaging component, through the exposed regions so as to improve packaging densities.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.