Slurry for slicing silicon ingot and method for slicing silicon ingot using the same
US8075647B2 · kind B2 · utility
11Cited by
1References
11Claims
0Family size
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Key dates
| Filing date | Oct 20, 2006 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Jul 25, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 25 to 55% by mass, based on a total mass of components of the slurry excluding the abrasive powder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.