Processes for reconditioning multi-component electrodes
US8075701B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2008 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Jun 1, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32559
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for reconditioning a multi-component electrode comprising a silicon electrode bonded to an electrically conductive backing plate is provided. The process comprises: (i) removing metal ions from the multi-component electrode by soaking the multi-component electrode in a substantially alcohol-free DSP solution comprising sulfuric acid, hydrogen peroxide, and water and rinsing the multi-component electrode with de-ionized water; (ii) polishing one or more surfaces of the multi-component electrode following removal of metal ions there from; and (iii) removing contaminants from silicon surfaces of the multi-component electrode by treating the polished multi-component electrode with a mixed acid solution comprising hydrofluoric acid, nitric acid, acetic acid, and water and by rinsing the treated multi-component electrode with de-ionized water. Additional embodiments of broader and narrower scope are contemplated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.