Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US8075745B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 5, 2005 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Oct 1, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23H5/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of conducting polishing elements each affixed to the compressible under-layer and passing through a sealed contact with a proton exchange membrane and corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate. The polishing pad may also include a slurry distribution material fastened to the guide plate by an adhesive. Pad wear sensors may also be provided in the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.