Integrally fabricated micromachine and logic elements
US8076738B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2007 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Sep 17, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/62
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of the invention are related to micromachine structures. In one embodiment, a micromachine structure comprises a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the first and second electrodes and adapted to oscillate between the first and second electrodes. Further, the sensing element comprises a FinFET structure having a height and a width, the height being greater than the width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.