Patent · US Active

Micromechanical component and method for producing a micromechanical component

US8076739B2 · kind B2 · utility

7Cited by

2References

7Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Peter Schmollngruber · Aidlingen, DE
Hans Artmann · Magstadt, DE
Thomas Wagner · Regelsbach, DE

Key dates

Filing date	May 26, 2008
Grant date	Dec 13, 2011
Priority date	—
Expiry date	May 26, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/73265
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A micromechanical component includes a substrate that has a front side and a backside, the front side having a functional pattern, which functional pattern is electrically contacted to the backside in a contact region. The substrate has at least one contact hole in the contact region, which extends into the substrate, starting from the backside.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.