Method for simulating thermal resistance value of thermal test die
US8078438B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2008 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Aug 29, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for simulating a thermal resistance value of a thermal test die is provided to estimate a relationship between the thermal resistance value of a heating block and the thermal resistance value of the thermal test die, and to find out a size of the heating block that matches an actual thermal situation of the thermal test die. In addition, after being tested by the heating block, the reliability of the testing result may be improved by verifying whether the relationship of a transient response of thermal resistance of the heating block and a steady-state response of thermal resistance of the thermal test die is within a range of a setting variation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.