Printed circuit board manufacturing method
US8079142B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2008 |
| Grant date | Dec 20, 2011 |
| Priority date | — |
| Expiry date | May 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a printed circuit board, including providing a core substrate and an electronic component contained in the core substrate, the electronic component having a die pad, forming a positioning mark on the core substrate, forming an interlayer insulating layer over the core substrate and the electronic component, forming a via hole opening connecting to the die pad of the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate, and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the die pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.