Integrated circuit packaging system with interposer interconnections and method of manufacture thereof
US8080446B2 · kind B2 · utility
2Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2009 |
| Grant date | Dec 20, 2011 |
| Priority date | — |
| Expiry date | May 27, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; and forming an encapsulation that encapsulates the integrated circuit, the routing structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.