Sensor module with mold encapsulation for applying a bias magnetic field

US8080993B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Horst Theuss · Wenzenbach, DE
• Helmut Wietschorke · Laberweinting, DE

Key dates

• Filing date: Mar 27, 2008
• Grant date: Dec 20, 2011
• Expiry date: Jul 23, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/48091
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method of manufacturing a sensor module includes providing a substrate comprising a magnetically sensitive sensor element. The sensor element and the substrate are encapsulated with at least one mold material that is configured to apply a bias magnetic field to the sensor element.