Embossed heat spreader
US8081474B1 · kind B1 · utility
111Cited by
471References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2008 |
| Grant date | Dec 20, 2011 |
| Priority date | — |
| Expiry date | Jan 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.