Integral facet cryopump, water vapor pump, or high vacuum pump
US8082741B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2007 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | Oct 26, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cluster tool has a transfer chamber, and a load lock chamber. An adaptor is configured to be coupled between the transfer chamber and the load lock chamber. The adaptor has an adaptor housing with an interior space including an entrance with a first valve and an exit with a second valve. The adaptor housing forms a substrate path through the interior space. The first valve connects the interior space and the load lock chamber. The second valve connects the interior space and the transfer chamber. A cryogenic surface is associated with the adaptor. Other pumps can be associated with the adaptor, such as, for example, a turbo pump, or water vapor pump. The cryogenic surface is configured to selectively evacuate the interior space. A wafer is adapted to be moved through the first valve and through the adaptor housing along the path. The wafer is moved through the exit and into the transfer chamber once the second valve is opened. This adaptor can be applied to the process chamber as well as the load lock.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.