Method for modular arrangement of a silicon based array and modular silicon based array

US8087753B2 · kind B2 · utility

Assignee

• Xerox Corporation · US

Inventors

• Mark A. Cellura · Webster, US
• Peter J. Nystrom · Webster, US
• Scott J. Phillips · West Henrietta, US
• John P. Meyers · Rochester, US
• Lyle G. Dingman · Fairport, US
• Bryan R. Dolan · Rochester, US

Key dates

• Filing date: Jan 19, 2010
• Grant date: Jan 3, 2012
• Expiry date: Feb 1, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/014
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.