Mark A. Cellura
55Patents
6h-index
60Co-inventors
75Inventor score
Filing activity: Nov 22, 1993 → May 27, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5528272A | Full width array read or write bars having low induced thermal stress | Performing Operations; Transporting | 51 | Expired |
| US5755024A | Printhead element butting | Emerging Cross-Sectional Technologies | 42 | Expired |
| US8147055B2 | Sticky baffle | Performing Operations; Transporting | 40 | Active |
| US6540315B1 | Systems and methods for stitching overlapping swaths | Physics | 22 | Expired |
| US8342652B2 | Molded nozzle plate with alignment features for simplified assembly | Emerging Cross-Sectional Technologies | 22 | Active |
| US8556611B2 | Method for interstitial polymer planarization using a flexible flat plate | Performing Operations; Transporting | 7 | Active |
| US5410340A | Off center heaters for thermal ink jet printheads | Performing Operations; Transporting | 6 | Expired |
| US7123854B1 | Printer contaminant abatement systems and methods | Physics | 4 | Expired |
| US7520588B2 | Apparatus for reducing ink jet contamination | Performing Operations; Transporting | 4 | Active |
| US6338544B1 | Reduction of stitch joint error by alternating print head firing mode | Performing Operations; Transporting | 4 | Expired |
| US7628466B2 | Method for increasing printhead reliability | Performing Operations; Transporting | 4 | Active |
| US7571996B2 | Apparatus for reducing particulate in an ink jet printer | Performing Operations; Transporting | 4 | Active |
| US8608293B2 | Process for adding thermoset layer to piezoelectric printhead | Emerging Cross-Sectional Technologies | 3 | Active |
| US8708465B1 | Method for protecting piezoelectric transducer | Performing Operations; Transporting | 3 | Active |
| US7506975B2 | Sticky baffle | Performing Operations; Transporting | 3 | Active |
| US8465659B2 | Polymer layer removal on pzt arrays using a plasma etch | Emerging Cross-Sectional Technologies | 2 | Active |
| US8182069B2 | Method for modular arrangement of a silicon based array and modular silicon based array | Electricity | 2 | Active |
| US8585187B2 | High density electrical interconnect for printing devices using flex circuits and dielectric underfill | Emerging Cross-Sectional Technologies | 2 | Active |
| US8366237B2 | Print head maintenance system for an ink-jet printer using phase-change ink printing on a continuous web | Performing Operations; Transporting | 1 | Active |
| US8984752B2 | Printhead fabrication using additive manufacturing techniques | Emerging Cross-Sectional Technologies | 1 | Active |
| US9168747B2 | Multi-layer electroformed nozzle plate with attenuation pockets | Emerging Cross-Sectional Technologies | 1 | Active |
| US9238365B1 | Flex circuit board with topographical structures to facilitate fluid flow through the layer | Performing Operations; Transporting | 1 | Active |
| US8550601B2 | Use of photoresist material as an interstitial fill for PZT printhead fabrication | Emerging Cross-Sectional Technologies | 1 | Active |
| US10166777B2 | Method of forming piezo driver electrodes | Emerging Cross-Sectional Technologies | 0 | Active |
| US10625466B2 | Extrusion printheads for three-dimensional object printers | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.