Power semiconductor module including a contact element
US8087943B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 23, 2009 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | Feb 18, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power semiconductor module including a contact element. One embodiment provides an electrically conductive contact element extending in a longitudinal direction and having a first end and a second end lying opposite the first end. The contact element has a first flange at its first end. The first flange is embodied such that when the contact element is placed with the first flange ahead onto a plane perpendicular to the longitudinal direction, the first flange has with the plane a number of first contact areas spaced apart from one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.