Molybdenum tubular sputtering targets with uniform grain size and texture

US8088232B2 · kind B2 · utility

Assignee

• H.C. STARCK INC. · US

Inventors

• Brad Lemon · Battle Creek, US
• Joseph Hirt · Cypress, US
• Timothy Welling · Portage, US
• James G. Daily, III · Marshall, US
• David Meendering · Coldwater, US
• Gary Alan Rozak · Akron, US
• Jerome O'Grady · Hudson, US
• Peter R. Jepson · Newbury, US
• Prabhat Kumar · Framingham, US
• Steven A. Miller · Pinellas Park, US
• Richard Wu · North Chelmsford, US
• Davd G. Schwarz · Mentor, US

Key dates

• Filing date: Aug 29, 2005
• Grant date: Jan 3, 2012
• Expiry date: Oct 6, 2028

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B22F2998/10
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

Molybdenum, sputtering targets and sintering characterized as having no or minimal texture banding or through thickness gradient. The molybdenum sputtering targets having a fine, uniform grain size as well as uniform texture, are high purity and can be micro-alloyed to improved performance. The sputtering targets can be round discs, square, rectangular or tubular and can be sputtered to form thin films on substrates. By using a segment-forming method, the size of the sputtering target can be up to 6 m×5.5 m. The thin films can be used in electronic components such as Thin Film Transistor-Liquid Crystal Displays, Plasma Display Panels, Organic Light Emitting Diodes, Inorganic Light Emitting Diode Displays, Field Emitting Displays, solar cells, sensors, semiconductor devices, and gate device for CMOS (complementary metal oxide semiconductor) with tunable work functions.