3D smart power module
US8088645B2 · kind B2 · utility
6Cited by
12References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2010 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | Sep 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.