Patent · US Active

System and method for providing access to an encapsulated device

US8088651B1 · kind B1 · utility

4Cited by

2References

20Claims

0Family size

Assignee

Innovative Micro Technology · US

Inventors

Douglas L. Thompson · Goleta, US
Gregory A. Carlson · Goleta, US
David M. Erlach · Lompoc, US

Key dates

Filing date	Sep 15, 2008
Grant date	Jan 3, 2012
Priority date	—
Expiry date	Jul 22, 2030

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C99/004
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer with the device wafer so that the cavity is located substantially above the feature, and removing material substantially uniformly from the bottom surface of the lid wafer, until an aperture is formed at the cavity, over the feature on the device wafer. By removing material from the lid wafer in a substantially uniform manner, difficulties with the prior art procedure of saw cutting, such as alignment and debris generation, are avoided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.