MEMS probe fabrication on a reusable substrate for probe card application
US8089294B2 · kind B2 · utility
3Cited by
46References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2008 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | Jul 20, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A Micro-Electro-Mechanical-Systems (MEMS) probe is fabricated on a substrate for use in a probe card. The probe has a bonding surface to be attached to an application platform of the probe card. The bonding surface is formed on a plane perpendicular to a surface of the substrate. An undercut is formed beneath the probe for detachment of the probe from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.