Patent · US Active

Device and method for evaluating defects in the edge area of a wafer and use of the device in inspection system for wafers

US8089622B2 · kind B2 · utility

7Cited by

10References

20Claims

0Family size

Assignee

Vistec Semiconductor Systems GmbH · DE

Inventors

Andreas Birkner · Jena, DE
Michael Hofmann · Taufkirchen, DE
Wolfgang Vollrath · Burbach, DE

Key dates

Filing date	Feb 28, 2008
Grant date	Jan 3, 2012
Priority date	—
Expiry date	Nov 4, 2030

Classification

Technology area (CPC G)Physics
CPC primaryG01N21/9503
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A device for evaluating defects in the edge area of a wafer (6) is disclosed. The evaluation may also be performed automatically. In particular, the device includes three cameras (25, 26, 27), each provided with an objective (30), wherein a first camera (25) is arranged such that the first camera (25) is opposite to an edge area on the upper surface (6a) of the wafer (6), wherein a second camera (26) is arranged such that the second camera (26) is opposite to a front surface (6b) of the wafer (6), and wherein a third camera (27) is arranged such that the third camera (27) is opposite to an edge area on the lower surface (6c) of the wafer (6).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.