Wedge bonding method incorporating remote pattern recognition system
US8091762B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2010 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Dec 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wire is bonded to a target surface using a rotary bond head by positioning a wedge bonding tool of the bond head over the target surface. A camera system is tilted at an oblique angle relative to an arrangement of the bond head to conduct pattern recognition of bonding points on the target surface for determining actual positions of the bonding points and an orientation between the actual positions of first and second bonding points. The bond head is moved to the actual position of the first bonding point and rotated to the determined orientation. Thereafter, the wire is bonded to the target surface at the first bonding point with the bond head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.