Method for fabricating plated product
US8092666B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2008 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Nov 7, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/007
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A bumper molding is fabricated by disposing segmented anodes 31 and 32 on surfaces 22 and 24 of a base material 20, which are to be plated, and performing electroplating so as to form metal films on the surfaces 22 and 24, respectively. The curvature of a surface of a concave portion, which is formed in each part of the surfaces 22 and 24 so that the surface of the concave portion is away from the segmented anodes 31 and 32, respectively, is larger than those of other portions at a part serving as a border between the second plated surface 22 and the fourth plated surface 24. Accordingly, the distance from the part serving as the border between the second plated surface 22 and the fourth plated surface 24 to a metal case 50a corresponding to this part is set so as to be shorter than those from each of the other parts to the metal cases 50a and 50b respectively corresponding to the segmented anodes 31 and 32.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.