Flexible thin image-sensing module with anti-EMI function and flexible thin PCB module with anti-EMI function
US8093509B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 9, 2009 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Jul 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0715
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible thin image-sensing module with anti-EMI function includes a flexible substrate unit, an electronic element unit, an anti-EMI unit, and a conductive structure. The electronic element unit has a plurality of electronic elements disposed on a top surface of the flexible substrate unit, and the electronic elements at least include an image sensor, a low dropout regulator and a backend IC. The anti-EMI unit is disposed on a bottom surface of the flexible substrate unit. The conductive structure passes through the flexible substrate unit and is electrically connected between the electronic element unit and the anti-EMI unit in order to guide electromagnetic waves generated by the electronic element unit to the anti-EMI unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.